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| DATA SHEET MOS FIELD EFFECT TRANSISTOR PA2717GR SWITCHING P-CHANNEL POWER MOS FET DESCRIPTION The PA2717GR is P-Channel MOS Field Effect Transistor designed for power management applications of notebook computers and Li-ion battery protection circuit. PACKAGE DRAWING (Unit: mm) 8 5 1, 2, 3 : Source 4 : Gate 5, 6, 7, 8 : Drain FEATURES * Low on-state resistance RDS(on)1 = 5.5 m MAX. (VGS = -10 V, ID = -7.5 A) RDS(on)2 = 8.9 m MAX. (VGS = -4.5 V, ID = -7.5 A) * Low Ciss: Ciss = 3550 pF TYP. * Built-in gate protection diode * Small and surface mount package (Power SOP8) 1 4 5.37 MAX. +0.10 -0.05 6.0 0.3 4.4 0.8 1.8 MAX. 1.44 0.05 MIN. ORDERING INFORMATION PART NUMBER PACKAGE Power SOP8 0.15 0.5 0.2 0.10 1.27 0.78 MAX. 0.40 +0.10 -0.05 0.12 M PA2717GR ABSOLUTE MAXIMUM RATINGS (TA = 25C, All terminals are connected.) Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) Drain Current (pulse) Note1 Note2 Note3 VDSS VGSS ID(DC) ID(pulse) PT1 PT2 Tch Tstg -30 m20 m15 m150 2 2 150 -55 to + 150 -15 22.5 V V A A W W C C A mJ Gate Protection Diode Source Gate Drain EQUIVALENT CIRCUIT Total Power Dissipation Total Power Dissipation Channel Temperature Storage Temperature Body Diode Single Avalanche Current Single Avalanche Energy Notes 1. 2. 3. 4. Note4 Note4 IAS EAS PW 10 s, Duty Cycle 1% Mounted on ceramic substrate of 1200 mm2 x 2.2 mm Mounted on glass epoxy board of 1 inch x 1 inch x 0.8 mm, PW = 10 sec Starting Tch = 25C, VDD = -15 V, RG = 25 , L = 100 H, VGS = -20 0 V Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G16950EJ1V0DS00 (1st edition) Date Published July 2004 NS CP(K) Printed in Japan 2004 PA2717GR ELECTRICAL CHARACTERISTICS (TA = 25C, All terminals are connected.) CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Note Note SYMBOL IDSS IGSS VGS(off) | yfs | RDS(on)1 RDS(on)2 RDS(on)3 TEST CONDITIONS VDS = -30 V, VGS = 0 V VGS = m20 V, VDS = 0 V VDS = -10 V, ID = -1 mA VDS = -10 V, ID = -7.5 A VGS = -10 V, ID = -7.5 A VGS = -4.5 V, ID = -7.5 A VGS = -4.0 V, ID = -7.5 A VDS = -10 V VGS = 0 V f = 1 MHz VDD = -15 V, ID = -7.5 A VGS = -10 V RG = 10 MIN. TYP. MAX. UNIT -1 m10 -1.0 13 4.7 6.1 6.9 3550 1260 600 17 32 920 510 5.5 8.9 10.4 A A V S m m m pF pF pF ns ns ns ns nC nC nC V ns nC -2.5 Drain to Source On-state Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Note Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr VDD = -24 V VGS = -10 V ID = -15 A IF = 15 A, VGS = 0 V IF = 15 A, VGS = 0 V di/dt = 50 A/s 130 11 36 0.82 500 1320 Note Pulsed TEST CIRCUIT 1 AVALANCHE CAPABILITY D.U.T. RG = 25 PG. VGS = -20 0 V - ID VDD 50 L VDD PG. BVDSS VDS VGS(-) 0 Starting Tch = 1 s Duty Cycle 1% VDS Wave Form TEST CIRCUIT 2 SWITCHING TIME D.U.T. RL RG VDD VDS(-) 90% 10% 10% 90% VGS(-) VGS Wave Form 0 10% VGS 90% IAS VDS 0 td(on) ton tr td(off) toff tf TEST CIRCUIT 3 GATE CHARGE D.U.T. IG = -2 mA PG. 50 RL VDD 2 Data Sheet G16950EJ1V0DS PA2717GR TYPICAL CHARACTERISTICS (TA = 25C) DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA dT - Percentage of Rated Power - % TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 120 PT - Total Power Dissipation - W 2.8 2.4 2 1.6 1.2 0.8 0.4 0 0 25 50 75 100 125 150 175 100 80 60 40 20 0 TA - Ambient Temperature - C Mounted on ceramic substrate of 1200 mm2 x 2.2 mm 0 25 50 75 100 125 150 175 TA - Ambient Temperature - C FORWARD BIAS SAFE OPERATING AREA - 1000 ID(pulse) PW = 100 s ID - Drain Current - A - 100 - 10 -1 - 0.1 RDS(on) Limited (at VGS = 10 V) ID(DC) 1 ms DC Power Dissipation Limited 10 ms 100 ms TA = 25C Single pulse Mounted on ceramic substrate of 1200 mm x 2.2 mm 2 - 0.01 - 0.01 - 0.1 -1 - 10 - 100 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000 rth(t) - Transient Thermal Resistance - C/W TA = 25C, Single pulse Rth(ch-A)1: Mounted on ceramic substrate of 1200 mm2 x 2.2 mm Rth(ch-A)2: Mounted on glass epoxy board of 1 inch x 1 inch x 0.8 mm Rth(ch-A)2 100 Rth(ch-A)1 10 1 0.1 100 1m 10 m 100 m 1 PW - Pulse Width - s Data Sheet G16950EJ1V0DS 10 100 1000 3 PA2717GR DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE FORWARD TRANSFER CHARACTERISTICS - 150 Pulsed - 125 ID - Drain Current - A ID - Drain Current - A - 1000 - 100 - 10 -1 - 0.1 - 0.01 0 - 0.2 - 0.4 - 0.6 - 0.8 -1 0 -1 -2 -3 -4 -5 VDS - Drain to Source Voltage - V VGS - Gate to Source Voltage - V - 100 - 75 - 50 - 25 0 VGS = -10 V -4.5 V -4.0 V VDS = -10 V Pulsed TA = 150C 75C 25C -40C GATE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE | yfs | - Forward Transfer Admittance - S FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT - 2.5 VGS(off) - Gate Cut-off Voltage - V 100 -2 - 1.5 -1 - 0.5 0 - 50 VDS = -10 V ID = -1 mA 10 TA = 150C 75C 25C -40C 1 VDS = -10 V Pulsed 0.1 - 0.1 -1 - 10 - 100 0 50 100 150 Tch - Channel Temperature - C ID - Drain Current - A RDS(on) - Drain to Source On-state Resistance - m RDS(on) - Drain to Source On-state Resistance - m DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 20 Pulsed 20 Pulsed ID = -7.5 A 15 VGS = -4 V 15 10 -4.5 V -10 V 10 5 5 0 -1 - 10 - 100 - 1000 ID - Drain Current - A 0 0 -5 - 10 - 15 - 20 VGS - Gate to Source Voltage - V 4 Data Sheet G16950EJ1V0DS PA2717GR DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE RDS(on) - Drain to Source On-state Resistance - m 15 Ciss, Coss, Crss - Capacitance - pF ID = - 7.5 A Pulsed V GS = -4.0 V -4.5 V - 10 V 10000 Ciss 1000 10 Coss Crss 5 100 VGS = 0 V f = 1 MHz 10 - 0.1 -1 - 10 - 100 0 - 50 0 50 100 150 Tch - Channel Temperature - C VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS 10000 VDS - Drain to Source Voltage - V td(on), tr, td(off), tf - Switching Time - ns - 30 - 15 VGS - Gate to Source Voltage - V 1000 VDD = -15 V VGS = -10 V RG = 10 ID =15 A VDD = -6 V -15 V -24 V td(off) tf - 20 - 10 100 tr td(on) - 10 VDS 0 VGS -5 10 1 -0.1 -1 -10 -100 0 50 100 0 150 ID - Drain Current - A QG - Gate Charge - nC SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs. DIODE FORWARD CURRENT 1000 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VF(S-D) - Source to Drain Voltage - V trr - Reverse Recovery Time - ns 1000 Pulsed IF - Diode Forward Current - A VGS = -10 V 0V 100 VGS = 0 V di/dt = 50 A/s 10 0.1 1 10 100 IF - Diode Forward Current - A Data Sheet G16950EJ1V0DS 5 PA2717GR SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD SINGLE AVALANCHE ENERGY DERATING FACTOR - 100 IAS - Single Avalanche Current - A Energy Derating Factor - % 100 80 60 40 20 0 0.1 1 10 IAS = -15 A - 10 EAS = 22.5 mJ VDD = -15 V RG = 25 VGS = -20 0 V IAS -15 A -1 VDD = -15 V VGS = -20 0 V RG = 25 Starting Tch = 25C - 0.1 0.01 25 50 75 100 125 150 L - Inductive Load - mH Starting Tch - Starting Channel Temperature - C 6 Data Sheet G16950EJ1V0DS PA2717GR * The information in this document is current as of July, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 |
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